The thermal management of high-density computing environments represents one of the most consequential engineering challenges ...

We might be witnessing the start of a new computing era where AI, cloud and quantum begin to converge in ways that redefine ...

The LSM6DSV320X is a 6-axis IMU with dual accelerometers and 3-axis gyroscope. The low-g accelerometer handles up to 16 g ...

Qualcomm's Snapdragon X2 Plus fills the same role as its predecessor: bringing Windows on Arm to sub-$1,000 notebooks with ...

Struggling with sluggish startups and leftover app trash? This lineup of optimizers, uninstallers, and tweaks frees up your ...

Apple's iPhone development roadmap runs several years into the future and the company is continually working with suppliers ...

Maximize your gaming laptop lifespan with expert maintenance tips for cooling, battery health, dust removal, and performance ...

PITTSBURGH, PA, UNITED STATES, January 5, 2026 /EINPresswire.com/ — Barbara F. of Aurora, CO is the creator of Magnifier Plus ...

Learn how Apple's on-device AI hardware and future MacBook chips will introduce powerful MacBook AI features, boosting ...

Broadcom has just announced the launch of its next-generation chips for Wi-Fi 8 access points at CES 2026 with the BCM4918 ...

Nordic Semiconductor's product announcements promise gains in AI and processing in edge environments and better local compute ...

HP unveiled the EliteBoard G1a at CES 2026, a groundbreaking keyboard-sized AI PC featuring AMD Ryzen AI 300 Series ...