SECO has launched the SOM-COMe-BT6-PTL, a new COM Express Type 6 module powered by new Intel Core Ultra Series 3 processors, which have just launched at CES in Las Vegas. The module provides customers ...
SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...
The Hackett Group, Inc. (NASDAQ: HCKT), a leading Gen AI consultancy and enterprise digital transformation firm, today announced the launch of Hackett AI XPLR™ 5.0, which supports enterprise AI ...
AAEON BOXER-8742AI is a fanless Edge AI embedded system powered by an NVIDIA Jetson T4000 that was unveiled along with the ...
The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
Press Trust of India on MSN
Innodisk Unveils the New 'AI on Dragonwing' Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm's SoC
Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed in collaboration with Qualcomm Technologies, Inc[1]. The flagship ...
As promised, we are here in Palo Alto, California, live at Rivian’s inaugural AI and Autonomy day, which the American automaker has been teasing for a month now. The event was filled with numerous ...
ROI appears to be on track, with four out of five seeing their gen AI investments paying off within three years.
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