Why it's essential to combine sign-off accuracy, iterative feedback, and intelligent automation in complex designs.
A new technical paper titled “DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design” was published (preprint) by researchers at UCSB and Cadence. “Thermal issue is a major ...
3D IC chiplet-based heterogeneous package integration represents the next major evolution in semiconductor design. It allows us to continue scaling system performance despite the physical limitationA ...
Skilled engineers remain the driving force for innovation in chips. But it’s no secret that electronic design automation (EDA) companies are folding AI into more of their offerings to speed up design ...
The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...
As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...
When analyzing the supply and demand of global semiconductor design talents in 2021, one finds US-based companies to be the main source of chip design demand. US-based companies accounted for 43% of ...
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