A common type of chip package that uses metal leads that extend outside the housing. Lead frame technology goes back to the early days of DIP chips, but is still widely used in many package varieties.

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...

The growing demand for power semiconductors, which control large currents and voltages, has resulted in their widespread use in various electronic devices, including electric vehicles (EVs). The ...