SAN JOSE, Calif., Sept. 30, 2024 (GLOBE NEWSWIRE) -- Adeia Inc. (Nasdaq: ADEA), a leader in invention of semiconductor technology, announced that several of its semiconductor technologists will ...

Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes to increase ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), a leading research and development and intellectual property licensing company known for bringing innovations in the semiconductor and ...

- Contributing to realization and wide spread of implementation in vertical GaN power devices - GaN devices are attracting attention as next-generation devices that combine high device characteristics ...

AuRoFUSE ™ is a composition of submicron-sized gold particles and a solvent that creates a bonding material with low electrical resistance and high thermal conductivity to achieve metal bonding at low ...

OKI (TOKYO: 6703) has successfully developed Tiling crystal film bonding (CFB; Note 1) technology using its proprietary CFB technology. This technology makes possible the heterogeneous integration of ...

Solvay, a global market leader in specialty materials, has expanded its range of FusePly® chemical bonding technology with a second product, FusePly ® 250, designed to bond composite structures at ...